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E05-MLE124AP2

[IC]:nRF24LE1

[Frequency]:2.4~2.525GHz

[Power]:20dBm

[Distance]:1.0km

[Interface]:IO

[Introduction]:E05-MLE124AP2 is based on original imported RF chip nRF24LE1 form Nordic in Norway. And equipped with 20dBm power amplifier chip imported from USA, which makes the transmitting power achieves 100mW (20dBm). QFN24, imported industrial components, lead-free process, built-in 51 microcontroller, stable performance, high communication speed, small-size by professional hardware design. All those features are all convenient for all kinds of embedded development.

硬件E05-MLE124AP2


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英E05-MLE124AP2引脚表


E05-MLE124AP2


产品
型号
IC Interface Frequency
Hz
Power
dBm
Distance
km
Air
data
rate
Package Size
(mm)
Feature技术
手册
样品
购买
E05-MLE124AP2 IO nRF24LE1 2.4G 20 1.0 250k~2M DIP 16.7*30.8 QFN24,Built in 51 MCU
E05-MLE132A IO nRF24LE1 2.4G 0 0.1 250k~2M DIP 17.8*21.5 QFN32,Built in 51 MCU
E05-MLE132AP2 IO nRF24LE1 2.4G 20 1.0 250k~2M DIP/SMD 17.8*30.6 QFN32,Built in 51 MCU
  • E05-MLE124AP2

    产品型号:E05-MLE124AP2

    IC :IO

    Interface :nRF24LE1

    Frequency Hz :2.4G

    Power dBm :20

    Distance km :1.0

    Air data rate :250k~2M

    Package :DIP

    Size (mm) :16.7*30.8

    Feature:QFN24,Built in 51 MCU

    PDF :

    购买:

  • E05-MLE132A

    产品型号:E05-MLE132A

    IC :IO

    Interface :nRF24LE1

    Frequency Hz :2.4G

    Power dBm :0

    Distance km :0.1

    Air data rate :250k~2M

    Package :DIP

    Size (mm) :17.8*21.5

    Feature:QFN32,Built in 51 MCU

    PDF :

    购买:

  • E05-MLE132AP2

    产品型号:E05-MLE132AP2

    IC :IO

    Interface :nRF24LE1

    Frequency Hz :2.4G

    Power dBm :20

    Distance km :1.0

    Air data rate :250k~2M

    Package :DIP/SMD

    Size (mm) :17.8*30.6

    Feature:QFN32,Built in 51 MCU

    PDF :

    购买:

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